Patents
Patent Portfolio of 26 Inventions
Rigid Circuit Board With Flexibly Attached Module
United States 9,746,879, Issued August 29, 2017
An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.
Method For Making An Electrical Circuit
United States 9,338,895, Issued May 10, 2016
A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a multilayer flexible circuit board having a plurality of electrical components on at least one surface, and further having a bifurcated area along one edge; forming electrode pads on the inner surfaces of the bifurcated area of the flexible circuit board that are alignable respectively with the electrical contacts on the rigid circuit board when the bifurcated area is spread apart by about 180°; spreading the bifurcated area apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.
Electronic Interconnect System
United States 8,902,606, Issued December 2, 2014
An electronic interconnect system comprises: a motherboard having electrical contacts on its upper and lower surfaces along a selected edge; an electronic module comprising a circuit board with electronic devices mounted thereon, and further comprising two opposing flexible portions that are openable outwardly from one another, the flexible portions having electrical contact pads on the opposing surfaces, so that when the flexible portions are placed on either side of the edge of the motherboard, the pads align with contacts on the respective surfaces of the motherboard and make electrical contact therewith.
Compression Connector System
United States 8,899,994, Issued December 2, 2014
An electrical interconnect system comprises: a clamping collar having a slot for receiving a bifurcated flexible circuit; a contact strip comprising a plurality of electrical contacts aligned with respective pads on the bifurcated flexible circuit when the legs of the bifurcated area are spread apart; and a compression latch member to engage the clamping collar and compress the pads against their respective contacts on the contact strip.
Electronic Module With Heat Spreading Enclosure
United States 8,837,141, Issued September 16, 2014
An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180°, the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and two metal heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.
Pierced Flexible Circuit and Compression Joint
United States 8,834,182, Issued September 16, 2014
An electrical interconnect system comprises: a flexible circuit having thereon a plurality of electrical contact pads; a contact strip comprising a plurality of electrical contacts aligned with respective pads on the flexible circuit; a compression member to engage the contacts with the pads; and pierced areas on said pads to enhance the mechanical engagement between the contacts and the pads.
Flexible Circuit Board and Connection System
United States 8,817,458, Issued August 26, 2014
An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.
Electrical Connector and Method of Making
United States 8,692,124, Issued April 8, 2014
An electrical connector comprises an elongated flexible circuit having rigid strips bonded onto one or both sides and one or more ends thereof. The strips contain metallized castellations that are aligned with respective metal traces on the flex circuit and soldered thereto. The flexible portion, along with the attached rigid board(s) forms a plug assembly that mates with a socket having contact pins that engage with their respective metallized castellations, with the castellations providing a self-aligning function. The invention may be used to form a flex cable with connectors on one or both ends. Alternatively, the elongated flexible circuit may represent an extension of a larger flex circuit substrate that further contains other electronic devices mounted thereon. The socket and contact pins are preferably attachable to a motherboard by soldering or other means.
Thin Multi-Chip Flex Module
United States 8,559,181, Issued October 15, 2013
A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remains unbonded, and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat-spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.
Thin Multi-Chip Flex Module
United States 8,345,431, Issued January 1, 2013
A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat-spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket, or they may be solderable to a printed circuit board.
Thin Multi-Chip Flex Module
United States RE42,252, Issued March 29, 2011
A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat-spreading covers. The electrodes and rigid members may be configured to engage a mating socket, or they may be solderable to a printed circuit board.
Thin Multi-Chip Flex Module
United States 7,796,399, Issued September 14, 2010
A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.
Thin Multi-Chip Flex Module
United States 7,787,254, Issued August 31, 2010
A multichip module comprises: a first rigid member defining one outer wall of a chamber; a second rigid member defining the opposite wall of the chamber; a sealable interface joining the first and second rigid members at their peripheries, whereby a hollow chamber is formed; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit affixed to at least one of the first and second rigid members; electrical contacts at least partially extending outward through the sealable interface; and a fluid inlet and a fluid outlet configured to permit fluid to flow through the chamber, whereby heat generated by the integrated circuit chips may be removed from the module.
Thin Multi-Chip Flex Module
United States 7,724,530, Issued May 25, 2010
A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket, or they may be solderable to a printed circuit board.
Thin Multi-Chip Flex Module
United States 7,520,781, Issued April 21, 2009
A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.
Thin Multi-Chip Flex Module
United States 7,429,788, Issued September 30, 2008
A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.
Thin Multi-Chip Flex Module
United States 7,394,149, Issued July 1, 2008
A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins. Alternatively, a low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; a socket configured to matably engage the module; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.
Thin Multi-Chip Flex Module
United States 7,393,226, Issued July 1, 2008
A socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and at least two fluid connections configured to matably engage corresponding fluid connections on the in-line module, whereby fluid may be circulated into and out of the module while maintaining electrical continuity between the pins and the contacts. Alternatively, a socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and a fluid connection configured to matably engage a corresponding fluid connection on the in-line module, whereby fluid may be introduced into the module through the socket and vented elsewhere while maintaining electrical continuity between the pins and the contacts.
Modular PC Card Which Receives Add-In PC Card Modules
United States 6,665,190, Issued December 16, 2003
A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Card includes one or more slots for receiving PC Card modules. PC Card slot openings are located on the narrow back end of the PC Card opposite the PCMCIA adapter, or alternatively are located on the wide end of the PC Card. In the preferred embodiment, the PC Card includes an internal module connector having connectors on either side. The PC Card modules are removably inserted into one or more slots and connect to the module connector contacts on the module connector within the PC Card. In one embodiment, the PC Card includes a rotating cam that is turned to connect the module connector contacts on the module connector within the PC Card to the contacts on the removable PC Card module. Therefore, the modular PC Card of the present invention allows the user to removably insert one or more modules in the PC Card to select desired functionality. This provides increased options to the user over the current prior art multifunction PC Cards.
Thin Multi-Chip Module
United States 6,232,659, Issued May 15, 2001
An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) include a composite substrate which comprises a thin metal cover plate and a thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the subassembly(s), comprising a cover plate with the composite substrate attached thereto, are permanently attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. In other embodiments, the subassembly(s) are removably attached to a module frame socket. The composite substrate employed in the present invention offers the advantages of allowing the components to be pre-assembled, tested, and repaired prior to final attachment into the molded frame, and aids in the transfer of heat away from the semiconductor devices operating thereon. The module frame provides a protective enclosure for the multichip semiconductor devices and can be molded for compatible mating with existing SIMM sockets. Other high-density contact means provide a greater interconnect capability.
Thin Multi-Chip Module Including A Connector Frame Socket
United States 6,091,145, Issued July 18, 2000
An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) include a composite substrate which comprises a thin metal cover plate and a thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the subassembly(s), comprising a cover plate with the composite substrate attached thereto, is permanently attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. In other embodiments, the subassembly(s) are removably attached to a module frame socket. The composite substrate employed in the present invention offers the advantages of allowing the components to be pre-assembled, tested, and repaired prior to final attachment into the molded frame, and aids in the transfer of heat away from the semiconductor devices operating thereon. The module frame provides a protective enclosure for the multichip semiconductor devices and can be molded for compatible mating with existing SIMM sockets. Other high-density contact means provide a greater interconnect capability.
Method of Forming A Thin Multichip Module
United States 6,049,975, Issued April 18, 2000
An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) include a composite substrate which comprises a thin metal cover plate and a thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the subassembly(s), comprising a cover plate with the composite substrate attached thereto, is permanently attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. In other embodiments, the subassembly(s) are removably attached to the module frame socket. The composite substrate employed in the present invention offers the advantages of allowing the components to be pre-assembled, tested, and repaired prior to final attachment into the molded frame, and aids in the transfer of heat away from the semiconductor devices operating thereon. The module frame provides a protective enclosure for the multichip semiconductor devices and can be molded for compatible mating with existing SIMM sockets. Other high-density contact means provide a greater interconnect capability.
Thin Multi-Chip Module Including A Connector Frame Socket Having First and Second Apertures
United States 5,751,553, Issued May 12, 1998
An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) include a composite substrate which comprises a thin metal cover plate and a thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the subassembly(s), comprising a cover plate with the composite substrate attached thereto, is permanently attached to the molded frame by a rectangular ring formed from an anisotropic material electrically conductive adhesive material. In other embodiments, the subassembly(s) are removably attached to a module frame socket. The composite substrate employed in the present invention offers the advantages of allowing the components to be pre-assembled, tested, and repaired prior to final attachment into the molded frame, and aids in the transfer of heat away from the semiconductor devices operating thereon. The module frame provides a protective enclosure for the multichip semiconductor devices and can be molded for compatible mating with existing SIMM
sockets. Other high-density contact means provide a greater interconnect capability.
Thin Multi-Chip Module
United States 5,731,633, Issued March 24, 1998
An improved multichip semiconductor module compatible with existing SIMM memory sockets, comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) include a composite substrate which comprises a thin metal cover plate and a thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the subassembly(s), comprising a cover plate with the composite substrate attached thereto, is permanently attached to the molded frame by a rectangular ring formed from an anisotropic electrically conductive adhesive material. In other embodiments, the subassembly(s) are removably attached to a module frame socket. The composite substrate employed in the present invention offers the advantages of allowing the components to be pre-assembled, tested, and repaired prior to final attachment into the molded frame, and aids in the transfer of heat away from the semiconductor devices operating thereon. The module frame provides a protective enclosure for the multichip semiconductor devices and can be molded for compatible mating with existing SIMM sockets. Other high-density contact means provide a greater interconnect capability.
Thin Multi-Chip Module
United States 5,708,297, Issued January 13, 1998
An improved multichip semiconductor module compatible with existing SIMM memory sockets, comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly (s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) include a composite substrate which comprises a thin metal cover plate and a thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the subassembly(s), comprising a cover plate with the composite substrate attached thereto, is permanently attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. In other embodiments, the subassembly(s) are removably attached to a module frame socket. The composite substrate employed in the present invention offers the advantages of allowing the components to be pre-assembled, tested, and repaired prior to final attachment into the molded frame, and aids in the transfer of heat away from the semiconductor devices operating thereon. The module frame provides a protective enclosure for the multichip semiconductor devices and can be molded for compatible mating with existing SIMM sockets. Other high-density contact means provide a greater interconnect capability.
Thin Multi-Chip Module
United States 5,661,339, Issued August 26, 1997
An improved semiconductor module comprising a molded frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the composite semiconductor substrate subassembly includes a composite substrate which comprises a thin metal cover plate and a thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the composite semiconductor substrate subassembly, comprising a cover plate with the composite substrate attached thereto, is attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. The composite substrate employed in the present invention offers the advantage of allowing the components to be pre-assembled, tested and repaired prior to final attachment into the molded frame.
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