Flex Configurations

MAT’s modular technology consists of a bifurcated flex circuit in which a 4 layer flexible circuit is partially separated into two halves that are folded and bonded to two separate heat spreaders. When the heat spreaders are closed together with the bifurcated portions of the flex acting as a hinge, the heat spreaders provide a multipurpose protective enclosure for thermal dissipation, EMI/ESD shielding, mechanical protection and, in the future, a reservoir for an integral hybrid super-capacitor/battery and liquid cooling for hyperscale devices.

The bifurcation of flex circuits (described in the technology section) enables novel and useful possibilities for modular packaging. MAT’s designs are both compatible with industry standards (backward compatible) and enablers of novel modular interconnect (forward compatible). The integral heat sink plays a role in tailoring the configuration of the module while the core flex circuit remains unchanged. The same module can therefore be inserted using standard sockets or directly to the motherboard using no socket or directly into an edge connector, as illustrated in the following descriptions.

The flex can be bent to 180 degrees, 90 degrees, or 15 degrees without altering the core module and possibly eliminating sockets.

15 Degrees Flex Bend

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