Services

MAT offers design, consulting, and assembly services pertaining to Flex Circuit and Flip Chip Packaging.

Microelectronics Assembly Technologies, Inc. is a Technology Licensing and process development service provider for high-end semiconductor customers that utilize module or add-in board packaging technology. MAT offers design and assembly services pertaining to flex circuit designs and Flip Chip assemblies. MAT offers low-volume assembly services for high-density interconnect multichip modular packaging.

• Converting wire bond chips to Flip Chip
• Low temperature processing 
• High density 
• 100-microns pitch 
• Fast prototype development 
• Chip on Flex Assembly and related packaging 
• Novel module connectors 
• Compression mating to motherboards